复合热沉环路热管的热点散热性能模拟研究

Simulation research on cooling performance of hotspots of a loop heat pipe with heat sink

中文关键词: 蒸发  数值模拟  传热  热点冷却  环路热管  热沉

英文关键词: evaporation  numerical simulation  heat transfer  hotspot cooling  loop heat pipe  heat sink

中文摘要:

      针对芯片功耗与集成度提高而导致的局部热点问题，设计了一种用于芯片散热的复合热沉环路热管系统。建立了环路热管蒸发段模型，通过数值模拟的方法，证明了复合热沉环路热管系统能够降低热点温度，提高散热表面的温度均匀程度，且散热效果与热点的分布位置有关。当热点的热流密度为160W/cm2，热沉横向、纵向导热率分别为1500W/(m?K)、24W/(m?K)时，热点温度为88.88°C，相比于无热沉时降低了5.96°C。研究了不同热沉导热率下的热沉厚度对热点温度的影响，结果表明：若导热率各项同性，热点温度随热沉厚度的增加而降低，之后趋向不变；若为各项异性，存在最优的热沉厚度，使热点温度最低。

英文摘要:

      Due to the hot spots caused by the increase of chip power consumption and integration, a loop heat pipe with heat sink for chip cooling was designed. The evaporating section model of the loop heat pipe was established. Through numerical simulation, it is proved that the loop heat pipe with heat sink can reduce the hotspot temperature and improve the temperature uniformity of the heat dissipa-tion surface, and the cooling effect is related to the location of the hotspot. When the hotspot heat flux is 160W/cm2, and the in-plane and thru-plane thermal conductivity of heat sink are 1500W/(m ? K) and 24W/(m ? K) respectively, the hot spot temperature is 88.88°C, which is 5.96°C lower than that of the LHP system without heat sink. The effect of heat sink thickness on the hotspot tempera-ture under different heat sink thermal conductivity was studied. It shows that if the thermal conduc-tivity is isotropic, the hotspot temperature decreases with the increase of the heat sink thickness, and then tends to be constant; if it is anisotropic, there is optimal heat sink thickness to minimize hotspot temperature.