文章摘要
黄双福,刘曦,袁俊威.半导体制冷元器件性能参数测试实验研究[J].,2021,20(6):521-527
半导体制冷元器件性能参数测试实验研究
Experimental Study on Measuring Performance Parameters of Semiconductor Refrigeration Components
投稿时间:2021-03-20  修订日期:2021-07-16
DOI:10.13738/j.issn.1671-8097.021068
中文关键词: 半导体制冷元器件  实验研究  性能参数
英文关键词: Experimental measurment of performance of semiconductor refrigeration components
基金项目:
作者单位E-mail
黄双福* 福州大学至诚学院 345914043@qq.com 
刘曦 福州大学  
袁俊威 福州大学  
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中文摘要:
      设计了一套半导体制冷元器件性能参数测试装置,利用该装置通过实验测得型号TEC1-12706半导体制冷元器件的制冷量和散热量,并结合实验数据与理论计算推导出半导体元器件冷热端温度及相关性能参数。实验结果表明,该装置可测试出半导体制冷元器件在不同温度下的电阻R、塞贝克系数 、导热系数K和优质系数Z等性能参数,同时,对测试结果的准确性进行了分析,指出实验测试的不足,并对测试数据进行了修正,修正结果显示半导体性能参数与平均温度之间的关系 。该装置对半导体制冷元器件性能参数测试具有一定的准确性,能够为半导体性能参数测试研究提供参考。
英文摘要:
      In this paper,a device for testing the performance parameters of semiconductor refrigeration components was designed , which can be used to measure the cooling capacity and heat dissipation of Model tec1-12706 semiconductor refrigeration components through experiments. Combined with experimental data and theoretical calculation, the temperature of the hot and cold ends of semiconductor components and related performance parameters are derived. The experimental results show that the device can test the re-sistance R, Seebeck coefficient α, thermal conductivity K and high-quality coefficient Z of semiconductor refrigeration components at different temperatures.At the same time, the accuracy of the test results is ana-lyzed, the shortcomings of the experimental tests are pointed out, and the test data is corrected. The correc-tion results show that the relationship between the semiconductor performance parameters and the average temperature is 、 、 、 .The device has a certain accuracy for the measurement of the performance param-eters of semiconductor refrigeration components, and can provide a reference for the measurement and re-search of the performance parameters of semiconductor.
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