沟槽式散热器水冷服务器基板流动与散热性能的研究

Experimental study on flow and heat transfer characteristics of grooved radiator water-cooling server base

中文关键词: 水冷、沟槽式散热器、压降、进出口水温

英文关键词: water-cooling  grooved radiator  pressure drop  inlet and outlet temperature

中文摘要:

      如何在较低功耗下,使服务器基板CPU低于规定温度已成为数据中心冷却问题的关键,研究了沟槽式水冷散热器对服务器基板芯片的散热。首先,通过开展沟槽式散热器冷却一个模拟CPU服务器基板的实验,对散热器水冷却过程的流动特性和传热特性做了研究,并分别获得“压降-流量”和“进口水温-流量”的性能拟合公式。其次,开展采用集成式沟槽散热器冷却含多CPU服务器基板的实验研究,通过实验测试,改变冷却水的流量和入口温度,以期获取芯片温度为70和80℃时所提供的最小能耗。实验结果表明：进口温度为25℃时,芯片温度维持在80℃以下的最佳流量为0.8 L/min；使芯片温度稳定在70℃以下的最佳流量为1.0L/min。

英文摘要:

      How to make working temperature of server base CPU under prescriptive temperature at low power consumption has become a key of cooling problem of data center. The water cooling grooved radiator is used to cool sever base chip. Firstly, the flow characteristics and heat transfer characteristics of radiator water cooling one CPU base are experimentally studied, and process “pressure drop-flow” and “inlet temperature-flow” fitting formula are acquired. Secondly, the compositive grooved fadiator cooling several CPU sever bases are investigated to get minimum energy consumption when chip temperature is maintained at 70 and 80℃ by changing the flow rate and inlet temperature of cooling water. Experimental results show when the inlet temperature of 25℃ and chip temperature is maintained at 80℃, the optimum flow is 0.8 L/min. The optimum flow is 1.0 L/min to maintain chip temperature at 70℃.