卫铃佼.压电泵驱动闭式水冷环路传热实验研究[J].,2020,19(5):459-463 |
压电泵驱动闭式水冷环路传热实验研究 |
Experimental Study on the Thermal Performance of Water Cooling Closed-Loop Driven by a Piezoelectric Pump |
投稿时间:2019-04-11 修订日期:2019-10-28 |
DOI:10.13738/j.issn.1671-8097.019077 |
中文关键词: 压电泵 微通道 水冷 电子器件散热 |
英文关键词: Piezoelectric pump Micro-channel Water cooling Electronic equipment heat dissipation |
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中文摘要: |
设计并研制全金属双腔串联有阀压电泵,利用压电泵驱动水工质在闭式环路内循环稳定流动。水冷环路热端设计为微通道结构,微通道结构能显著增强液相工质流动过程中与壁面换热速率。在压电泵驱动下,工质在微通道热端吸热,冷端放热,实现热量从热端到冷端高效传递。搭建实验测试系统,研究压电泵工作性能以及压电泵驱动水冷环路传热性能。结果表明,压电泵在开放系统和闭式系统工作性能一致。压电泵驱动电压越大,回路内液相工质流动速度越快,传热速率越高,系统热阻越低。双腔串联压电泵在120V驱动电压下,泵水流量达到167 mL/min,水冷环路热阻达到0.12℃/W。压电泵驱动闭式水冷环路具有热阻小,结构紧凑,能耗低,智能控制等优点,能更好地应用于大功率电子器件散热领域。 |
英文摘要: |
A metal dual-chamber tandem piezoelectric pump is designed and manufactured in this paper, which is applied in the water cooling closed-loop to provide the cyclically stable flow. The fluid flow structure of the heating side is designed as micro-channel for the micro channel can enhance the heat transfer between the flowing fluid and the heating wall. Driven by the piezoelectric pump in the closed loop, the fluid is heated at the heating side and is cooled at the cooling side, which obtains the efficient heat transport. An experimental test system is built to investigate the work ability of the piezoelectric pump and the thermal performance of the water cooling loop. The results show that the work ability of the piezoelectric pump in the closed loop is as same as that in the open system. The higher the driven voltage of the piezoelectric pump, the higher mass flow rate of the working fluid in the loop, which can achieve a better heat transfer rate and lower thermal resistance. When the driven voltage of the pump is 120 V, the volume flow rate of the working fluid reaches 167 mL/min and the thermal resistance of the water cooling loop reaches 0.12 ℃/W. The designed heat transfer system can take the advantages of the low thermal resistance, com-pact structure, low energy consumption and flexible control, which has important practical value in the electronic equipment heat dissipation field. |
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